SIM-S-IO3-TRI-2

SIM-S-IO3-TRI-2

  • image of Subscriber Identification Module (SIM) Cards>SIM-S-IO3-TRI-2
  • image of Subscriber Identification Module (SIM) Cards>SIM-S-IO3-TRI-2
SIM-S-IO3-TRI-2
Subscriber Identification Module (SIM) Cards
1GLOBAL
2FF/3FF/4FF SIM
-
Bulk
Infrared Light Emitting Diodes Side View Type
Infrared Light Emitting Diodes Side View Type
Infrared Light Emitting Diodes Top View Type
Infrared Light Emitting Diodes Top View Type
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
Level 7 Surface Mount Mixer, LO/RF from 750.0 to 4200.0 MHz
Level 7 Surface Mount Mixer, LO/RF from 3700.0 to 10000.0 MHz
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
DBL BAL MIX / SURF MT / RoHS
Level 7 Surface Mount Mixer, LO/RF from 2300.0 to 8000.0 MHz
DBL BAL MIX / SURF MT / RoHS
Level 7 Surface Mount Mixer, LO/RF from 3400.0 to 15000.0 MHz
6+2PIN抽屉式
SIM 6PIN内焊式
8+1PIN外焊自弹式
8+2 10PIN外焊自弹式
6PIN外焊自弹式
6PIN外焊自弹
6+2常开外焊自弹式
2.54mm Simm socket dip 180 1X30
6+1PIN常闭外焊自弹式
SIM 6PIN全塑
6PIN翻盖式
6+2PIN外焊自弹式
Chip Bead (42)
Molded Inductor (149)
Power Inductors (7)
Chip Bead (42)
Chip Bead (42)
Chip Bead (42)
Chip Coil Inductors (4)
Power Inductors (7)
Molded Inductor (149)
RF Inductors (6)


2FF/3FF/4FF SIM FOR 2G/3G/LTE IO

Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
Mfr1GLOBAL
Series-
PackageBulk
Product StatusACTIVE
Format2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature-25°C ~ 85°C
Core ProcessorST33G1M2
ClassA (5V), B (3V), C (1.8V)
Memory1280Kb Flash, 30Kb RAM
Carrier NetworkUniversal
Network Technology2G, 3G, 4G LTE IOT

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