QL3P1K-6WDN30C FPGAs (Field Programmable Gate Array)_Electronic components_ Integrated circuit IC_ Semiconductor components_ Equipment procurement_ EIS LIMITED

：	QL3P1K-6WDN30C
：	FPGAs (Field Programmable Gate Array)
：	QuickLogic
：	POLARPRO 3 ULTR
：	-
：	Tape & Reel (TR)
：	1

QL单相整流桥堆

桥堆

40,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

4,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

12,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

12,000 usable PLD gate pASIC3 FPGA combining high performance and high density.

25,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

60,000 usable PLD gate pASIC 3 FPGA combining high performance and high density.

Up to 60,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

2.4-3.5V MLA power chip

Standard Serial Flash

桥堆

RQL Radial-Leaded Electrolytic Capacitors

IC MCU 8BIT 6KB FLASH 16TSSOP

IC MCU 8BIT 6KB FLASH 16SOIC

焊片式铝电解电容器

引线式铝电解电容器

引线型铝解电容器

引线式铝电解电容器

焊片式铝电解电容器

引线型铝解电容器

引线式铝电解电容器

焊片式铝电解电容器

引线式铝电解电容器

引线型铝解电容器

焊片式铝电解电容器

引线式铝电解电容器

焊片式铝电解电容器

引线式铝电解电容器

引线型铝解电容器

引线式铝电解电容器

焊片式铝电解电容器

TYPE	DESCRIPTION
Mfr	QuickLogic
Series	-
Package	Tape & Reel (TR)
Product Status	ACTIVE
Package / Case	30-WLCSP
Mounting Type	Surface Mount
Operating Temperature	-20°C ~ 85°C (TJ)
Voltage - Supply	1.2V
Number of Logic Elements/Cells	1019
Supplier Device Package	30-CSP (2.09mm x 2.54mm)
Total RAM Bits	65536
Number of I/O	18
DigiKey Programmable	Not Verified